20 maggio 2012 10:51

Registrati | Reset Password | Accesso

TechNexion TDM-3730

logo - TechNexion
scheda - TechNexion TDM-3730
Processore TI DM3730 — Architettura ARM Cortex-A8 — Connessione SO-DIMM

Processore TI DM3730 con CPU ARM Cortex-A8 e POWERVR SGX 530 per l’accelerazione grafica 2D e 3D.
Il connettore SO-DIMM a 200 pin che supporta LAN, USB, UART, SPI, I2C, segnali di telecamera LCD rende il TDM-3730 ideale per l’utilizzo industriale e multimediale.
Board Support Package (BSP) disponibile per creare le vostre applicazioni con Windows CE, Linux e Android.

TI DM3730 System on Module

Processor TI Sitara DM3730 @ 1Ghz
DSP Core
TMS320C64x+™ @ 800Mhz
Memory 512 MB Low Power DDR (other configurations available upon request)
Storage
512 MB NAND Flash
Wireless LAN
802.11b/g
Supported OS Linux 2.6.x, Windows CE 6 and Android
Connectors
  • 200 pin SO-DIMM
  • SPI
  • UART
  • USB host, USB OTG/client
  • I2C
  • PWM lines
  • 1-wire
  • MMC lines
  • A/D lines
  • camera
  • audio in/out, mic
  • S-Video, Display interface
  • keypaw
  • LAN
Chipset POWERVR SGX 530 20Mpolys/s, up to 720p resolution
ATI Support OpenGL 2.0, OpenGLes 1.1, OpenVG 1.0
Power consumption <2.0 Watt with Wireless enabled
Standby <50 mWatt
Power requirements 5V
Temperature
  • Commercial: 0° to 70° C
  • Extended: -20° to 70° C
  • Industrial: -40° to 85° C
Humidity 10-90%
Dimensions
  • 67.6 x 50 x 3.4 mm
  • 2⅝ x 2 x ¼ inch
MTFB >100,000 hours
Weight 12 grams
Shock 50G / 25ms
Vibration 20G / 0-600 Hz